@sekhmetdesign This is happening like every week or two now, and I'd really like to know the root cause.
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0h00000000@ioc.exchange
@0h00000000@ioc.exchange
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I normally wake up at 6:30, but today I woke up at 4:30, tossed and turned until 6, and gave up and put on a pot of coffee. -
I normally wake up at 6:30, but today I woke up at 4:30, tossed and turned until 6, and gave up and put on a pot of coffee.I normally wake up at 6:30, but today I woke up at 4:30, tossed and turned until 6, and gave up and put on a pot of coffee.
I would plan for an afternoon nap, but I have a client visit at noon. It's gonna be a very long day.
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Packed!Packed! No PCB for this rush job.
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Thinking more about energy upgrades in the lab: i have a 2U that just acts as a host for a bunch of FPGA devkits to run jtag/uart hosts etc.@azonenberg I have a 25' active FO SS cable I used to connect a Saleae to my desktop, Works great. I have a 50' FO 2.0 cable I use for debugging a image sensor out the window in the other room, works great.
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Did i put this in backwards or something?@azonenberg @karotte probably not gonna handle much temp above 30C…
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Random thought.@anymouse_404 Probably because if there is any slight warpage of the board or the part, some pads would not make contact. A ball protrudes in the Z axis and will stick into the mound of solder paste.
