So I'm thinking about what to use as the guts of the gen2 reworkctf board.
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@0h00000000 That's an 0.5mm pitch package
@0h00000000 Drilling out new vias or adding tracks between balls on 0.5mm is much harder than 0.8 or 1 (something *I* haven't attempted to date). I'm not going to put that on this challenge.
Maybe a sequel if some Chinese phone repair guy thinks it's too easy.
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@0h00000000 Drilling out new vias or adding tracks between balls on 0.5mm is much harder than 0.8 or 1 (something *I* haven't attempted to date). I'm not going to put that on this challenge.
Maybe a sequel if some Chinese phone repair guy thinks it's too easy.
@0h00000000 The smallest / cheapest 0.8mm packages I know of are like the UFBGA144 for F4s.
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So I'm thinking about what to use as the guts of the gen2 reworkctf board.
I want a BGA of relatively large (0.8 or 1 mm) pitch to allow practicing of BGA site rework without being 11/10 difficulty level right out of the gate.
The STM32H750XBH6 is $12.39 at digikey in single units, sub $10 in higher volume, although currently sold out until April (I have enough on the shelf to prototype with), 0.8mm depopulated 265-BGA.
The cheapest Xilinx part in a 1mm FTGB196 is the XC7S6-1FTGB196C at $20.94 qty1 price.
Any other ideas? A lot of the really low cost parts are like 0.5mm or WLCSP which defeats the point of using a large pitch to make the challenge not too crazy difficult.
Not serious (terrible availability):
LCMXO2-1200UHC-4FTG256C | Lattice | Price | In Stock | LCSC Electronics
LCMXO2-1200UHC-4FTG256C by Lattice - In-stock components at LCSC. Price from $4.3437. Free access LCMXO2-1200UHC-4FTG256C datasheet, Package, pinout diagrams, and BOM tools.
LCSC Electronics (www.lcsc.com)
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Not serious (terrible availability):
LCMXO2-1200UHC-4FTG256C | Lattice | Price | In Stock | LCSC Electronics
LCMXO2-1200UHC-4FTG256C by Lattice - In-stock components at LCSC. Price from $4.3437. Free access LCMXO2-1200UHC-4FTG256C datasheet, Package, pinout diagrams, and BOM tools.
LCSC Electronics (www.lcsc.com)
@azonenberg ECP5-12F used to fit this bill but they've hiked prices and reduced availability
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@azonenberg ECP5-12F used to fit this bill but they've hiked prices and reduced availability
@ldcd i feel like i could probably save a dollar or two with a slightly smaller stm32 but the h750 is one i have on the shelf which counts for something too
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@ldcd i feel like i could probably save a dollar or two with a slightly smaller stm32 but the h750 is one i have on the shelf which counts for something too
@azonenberg the H7s are just really nice all around
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@azonenberg the H7s are just really nice all around
@ldcd yeah it's just overkill lol.
I might borrow an idea from @cccpresser and break out some IOs to connectors so it becomes a useful devkit not ewaste when you're done with the challenge. That makes a bigger mcu easier to justify
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@ldcd yeah it's just overkill lol.
I might borrow an idea from @cccpresser and break out some IOs to connectors so it becomes a useful devkit not ewaste when you're done with the challenge. That makes a bigger mcu easier to justify
@azonenberg @cccpresser I mean yeah I think that's absolutely a good idea
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@azonenberg @cccpresser I mean yeah I think that's absolutely a good idea
@ldcd @cccpresser yep it is, it never occurred to me on the first iteration but for rev 2 I'll definitely be doing it
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@ldcd @cccpresser yep it is, it never occurred to me on the first iteration but for rev 2 I'll definitely be doing it
@azonenberg @cccpresser 0.4 but long pads https://www.digikey.com/en/products/detail/epc/EPC8009/4990585
Could have a little switch mode for funzies.
I think having a dev board you've done some rework on makes people more likely to use it
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@azonenberg @cccpresser 0.4 but long pads https://www.digikey.com/en/products/detail/epc/EPC8009/4990585
Could have a little switch mode for funzies.
I think having a dev board you've done some rework on makes people more likely to use it
@ldcd Lol.
I specifically need a large-ish pitch BGA (which makes sense to be the main processor of the system) for BGA site rework challenges though.
I think I'm gonna run with the H750.
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@0h00000000 That's an 0.5mm pitch package
@azonenberg ST "TFBGA" should be .8mm, but the dist may have the info wrong.
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