Hello!
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Hello! It's #nakeddiefriday today, and what I got for you is yet another smartcard chip. Please welcome an unnamed die marked K2D0A, fabbed by STMicro. This came from [REDACTED], used to [REDACTED]. The die oriented with power supply pads on top, so it's possible to figure out which die pads correspond to which module pads. Unusually enough, there are 6 pads bonded out; the function of the extra
pad is not known at this time-- certainly not VPP.A short thread follows.
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R relay@relay.infosec.exchange shared this topic
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Hello! It's #nakeddiefriday today, and what I got for you is yet another smartcard chip. Please welcome an unnamed die marked K2D0A, fabbed by STMicro. This came from [REDACTED], used to [REDACTED]. The die oriented with power supply pads on top, so it's possible to figure out which die pads correspond to which module pads. Unusually enough, there are 6 pads bonded out; the function of the extra
pad is not known at this time-- certainly not VPP.A short thread follows.
Die ID for visual identification. There is no ST logo, but it is highly certain it's them. Alignment and mask revision marks are also visible.
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Die ID for visual identification. There is no ST logo, but it is highly certain it's them. Alignment and mask revision marks are also visible.
Right there lies mesh circuitry: three rows of contacts going to mesh wires on top of the die. Technically, the design has a mesh layer... but it is as effective as a fig leaf.
