Hello!
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Hello! It's #nakeddiefriday today, and what I got for you is yet another smartcard chip. Please welcome an unnamed die marked K2D0A, fabbed by STMicro. This came from [REDACTED], used to [REDACTED]. The die oriented with power supply pads on top, so it's possible to figure out which die pads correspond to which module pads. Unusually enough, there are 6 pads bonded out; the function of the extra
pad is not known at this time-- certainly not VPP.A short thread follows.
#electronics #reverseengineering #smartcards
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R relay@relay.infosec.exchange shared this topic
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Hello! It's #nakeddiefriday today, and what I got for you is yet another smartcard chip. Please welcome an unnamed die marked K2D0A, fabbed by STMicro. This came from [REDACTED], used to [REDACTED]. The die oriented with power supply pads on top, so it's possible to figure out which die pads correspond to which module pads. Unusually enough, there are 6 pads bonded out; the function of the extra
pad is not known at this time-- certainly not VPP.A short thread follows.
#electronics #reverseengineering #smartcards
Die ID for visual identification. There is no ST logo, but it is highly certain it's them. Alignment and mask revision marks are also visible.
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Die ID for visual identification. There is no ST logo, but it is highly certain it's them. Alignment and mask revision marks are also visible.
Right there lies mesh circuitry: three rows of contacts going to mesh wires on top of the die. Technically, the design has a mesh layer... but it is as effective as a fig leaf.
