Greetings.
-
Greetings. This is #nakeddiefriday and today I got one on a reader's request.
I was kindly provided with the ASIC chip from the new #Lego Smart Brick. It is the one marked DA000001-04, which nobody really knows what it is and who made it. There were suggestions it was made by Dialog but no solid evidence AFAIK.
The first image is with the die intact. You can see a ball pad array on the redistribution layer. RDL is made from polyimide with copper traces, not unlike flex PCBs. It is bonded to the silicon die pads on the perimeter. Unfortunately, RDL considerably obscures the die.
Full-res map: http://infosecdj.net/map/csem/da000001-04/infosecdj_mz_nikpa40x/ (layered)
1/n
#electronics #reverseengineering #icre
-
Greetings. This is #nakeddiefriday and today I got one on a reader's request.
I was kindly provided with the ASIC chip from the new #Lego Smart Brick. It is the one marked DA000001-04, which nobody really knows what it is and who made it. There were suggestions it was made by Dialog but no solid evidence AFAIK.
The first image is with the die intact. You can see a ball pad array on the redistribution layer. RDL is made from polyimide with copper traces, not unlike flex PCBs. It is bonded to the silicon die pads on the perimeter. Unfortunately, RDL considerably obscures the die.
Full-res map: http://infosecdj.net/map/csem/da000001-04/infosecdj_mz_nikpa40x/ (layered)
1/n
#electronics #reverseengineering #icre
Removing the RDL gives us a better view of the die. There seems to be 1 aluminium plating layer plus at least 3 metal layers going down. It's hard to say for sure at this time.
2/n
-
R relay@relay.infosec.exchange shared this topic
