Advanced PCB folks (maybe @dlharmon or @0h00000000 ?): How widely available is controlled depth milling, and how much of a cost adder is it usually in low volume?
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Advanced PCB folks (maybe @dlharmon or @0h00000000 ?): How widely available is controlled depth milling, and how much of a cost adder is it usually in low volume?
I need a few mm along one edge of a 4-layer board milled down to layer 2 so that I have the inner layer ground plane exposed.
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Advanced PCB folks (maybe @dlharmon or @0h00000000 ?): How widely available is controlled depth milling, and how much of a cost adder is it usually in low volume?
I need a few mm along one edge of a 4-layer board milled down to layer 2 so that I have the inner layer ground plane exposed.
I've only done this once and it was on a board that was already somewhat exotic but I don't recall it being a huge cost adder.
There are two ways to do this. What I had done, they used low flow prepreg and punched that before lamination, then milled out the layers above. The alternate is to mill just past the layer and plate the whole thing like a big blind via. There won't be enough precision to stop at the actual layer. JLC will do the latter (blind slots) for extra.